Wafer Scribing MachineOperation Workflow:Wafer Marking Workflow:1. Manually place the wafer face-down on the worktable; the wafer is then secured via vacuum suction.2. The lower gl

Wafer Cleaving EquipmentApplication ScenariosUtilizing a cleaving blade and a stage, and driven by the physical force of a hammer mechanism,this equipment enables processed wafer p

Gantry-type Pick-and-Place MachineApplication ScenariosThe equipment features a dual-drive gantry platform and a customized material loading platform, compatible with Gel-Pak, Wafe

Pre-sintering Pick-and-Place MachineApplication ScenariosThis equipment features a dual-drive gantry platform and utilizes a customized feeding system compatible with wafer expansi

MEMS Pressure Sensor Automated Assembly LineApplication ScenariosMEMS Pressure Sensor Automated Assembly LineKey components include: an automatic board loader, a laser cutting and

MEMS Pressure Sensor Automated Assembly LineApplication ScenariosThis automated MEMS sensor packaging line integrates product calibration directly into the production workflow.Equi

Oil-Filled Sensor Core Assembly and Testing LineApplication ScenariosThe oil-filled core assembly line comprises: core mounting equipment, adhesive curing equipment,plasma cleaning

Sensor Rotating Dual-Station Welding WorkbenchApplication ScenariosLaser Sensor Rotary Dual-Station Welding WorkbenchThis system comprises a 3D motion module, a structural frame, a

Oil Pressure Sensor Assembly LineApplication ScenariosThe Oil-Filled Core Assembly Line comprises: Sensor Sintered Base Feeding Station, Adhesive Dispensing Station,SMT Curing Equi